Ku-Feng Lin, Hiroki Noguchi, Yi-Chun Shih, Perng-Fei Yuh, Yuan-Jen Lee, Tung-Cheng Chang, Sheng-Po Huang, Yu-Fan Lin, Chun-Ying Lee, Yen-Hsiang Huang, Jui-che Tsai, Saman Adham, Peter Noel, Ramin Yazdi, Marat Gershoig, YangJae Shin, Vineet Joshi, Ted Wong, Meng-Ru Jiang, J.-J. Wu, Chun-Tai Cheng, Yu-Jen Wang, Harry Chuang, Yu-Der Chih, Yih Wang, Tsung-Yung Jonathan Chang. 12 Write Endurance and Integrated Margin-Expansion Schemes. In IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024. pages 292-294, IEEE, 2024. [doi]
@inproceedings{LinNSYLCHLLHTANYGSJWJWCWCCWC24,
title = {12 Write Endurance and Integrated Margin-Expansion Schemes},
author = {Ku-Feng Lin and Hiroki Noguchi and Yi-Chun Shih and Perng-Fei Yuh and Yuan-Jen Lee and Tung-Cheng Chang and Sheng-Po Huang and Yu-Fan Lin and Chun-Ying Lee and Yen-Hsiang Huang and Jui-che Tsai and Saman Adham and Peter Noel and Ramin Yazdi and Marat Gershoig and YangJae Shin and Vineet Joshi and Ted Wong and Meng-Ru Jiang and J.-J. Wu and Chun-Tai Cheng and Yu-Jen Wang and Harry Chuang and Yu-Der Chih and Yih Wang and Tsung-Yung Jonathan Chang},
year = {2024},
doi = {10.1109/ISSCC49657.2024.10454339},
url = {https://doi.org/10.1109/ISSCC49657.2024.10454339},
researchr = {https://researchr.org/publication/LinNSYLCHLLHTANYGSJWJWCWCCWC24},
cites = {0},
citedby = {0},
pages = {292-294},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2024, San Francisco, CA, USA, February 18-22, 2024},
publisher = {IEEE},
isbn = {979-8-3503-0620-0},
}