Yibo Lin, Bei Yu, David Z. Pan. High Performance Dummy Fill Insertion With Coupling and Uniformity Constraints. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(9):1532-1544, 2017. [doi]
@article{LinYP17,
title = {High Performance Dummy Fill Insertion With Coupling and Uniformity Constraints},
author = {Yibo Lin and Bei Yu and David Z. Pan},
year = {2017},
doi = {10.1109/TCAD.2016.2638452},
url = {https://doi.org/10.1109/TCAD.2016.2638452},
researchr = {https://researchr.org/publication/LinYP17},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {36},
number = {9},
pages = {1532-1544},
}