Yu-Chen Lin, Kai-Chun Zhan, Ji-Min Zhang, Jian-Ming Chen, Cheng-Hsun-Tony Chang, Shea-Jue Wang, Mu-Chun Wang. Junction Integrity for 28nm High-k nMOSFETs with Thermal Stress. In 3rd IEEE International Conference on Knowledge Innovation and Invention, ICKII 2020, Kaohsiung, Taiwan, August 21-23, 2020. pages 64-66, IEEE, 2020. [doi]
Abstract is missing.