Ren-Jean Liou, Kuang-Chian Kao, Chin-Yung Yeh. Evaluation of Crack Flaws in Ultrasonic Imaging. In William Cheng-Chung Chu, Han-Chieh Chao, Stephen Jenn-Hwa Yang, editors, Intelligent Systems and Applications - Proceedings of the International Computer Symposium (ICS) held at Taichung, Taiwan, December 12-14, 2014. Volume 274 of Frontiers in Artificial Intelligence and Applications, pages 1125-1134, IOS Press, 2014. [doi]
Abstract is missing.