Leaf area index estimation under wheat powdery mildew stress by integrating UAV‑based spectral, textural and structural features

Yang Liu, Lulu An, Nan Wang, Weijie Tang, Minjia Liu, Gouhui Liu, Hong Sun, Minzan Li, Yuntao Ma. Leaf area index estimation under wheat powdery mildew stress by integrating UAV‑based spectral, textural and structural features. Computers and Electronics in Agriculture, 213:108169, October 2023. [doi]

@article{LiuAWTLLSLM23,
  title = {Leaf area index estimation under wheat powdery mildew stress by integrating UAV‑based spectral, textural and structural features},
  author = {Yang Liu and Lulu An and Nan Wang and Weijie Tang and Minjia Liu and Gouhui Liu and Hong Sun and Minzan Li and Yuntao Ma},
  year = {2023},
  month = {October},
  doi = {10.1016/j.compag.2023.108169},
  url = {https://doi.org/10.1016/j.compag.2023.108169},
  researchr = {https://researchr.org/publication/LiuAWTLLSLM23},
  cites = {0},
  citedby = {0},
  journal = {Computers and Electronics in Agriculture},
  volume = {213},
  pages = {108169},
}