Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires

Zaiyong Liu, Hai-Bao Chen, Tianshu Hou. Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires. In 2020 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2020, Ha Long, Vietnam, December 8-10, 2020. pages 62-65, IEEE, 2020. [doi]

Abstract

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