Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test - researchr publication authors

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Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman. Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectronics Reliability, 53(1):70-78, 2013. [doi]

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