Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman. Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. Microelectronics Reliability, 53(1):70-78, 2013. [doi]
@article{LiuCSTS13,
title = {Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test},
author = {Xi Liu and Qiao Chen and Venkatesh Sundaram and Rao R. Tummala and Suresh K. Sitaraman},
year = {2013},
doi = {10.1016/j.microrel.2012.06.140},
url = {http://dx.doi.org/10.1016/j.microrel.2012.06.140},
researchr = {https://researchr.org/publication/LiuCSTS13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {1},
pages = {70-78},
}