The Research on Non-destructive Testing Method of Sheet Resistance in Micro Area of Silicon Wafer Based on EIT Technology

Xinfu Liu, Jinhe Liu, Zhanping Du, Quanming Zhao, Junying Zhao, Yuhui Huang. The Research on Non-destructive Testing Method of Sheet Resistance in Micro Area of Silicon Wafer Based on EIT Technology. In Jeng-Shyang Pan, Xiamu Niu, Hsiang-Cheh Huang, Lakhmi C. Jain, editors, 4th International Conference on Intelligent Information Hiding and Multimedia Signal Processing (IIH-MSP 2008), Harbin, China, 15-17 August 2008, Proceedings. pages 1494-1497, IEEE Computer Society, 2008. [doi]

Abstract

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