A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds

Chien-Pan Liu, Yen-Fu Liu, Chang-Hung Li, Hung-Chieh Cheng, Yi-Chun Kung, Jeng-Yu Lin. A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds. Microelectronics Reliability, 52(4):725-734, 2012. [doi]

Abstract

Abstract is missing.