Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinman, Jason Cong. Fine grain 3D integration for microarchitecture design through cube packing exploration. In 25th International Conference on Computer Design, ICCD 2007, 7-10 October 2007, Lake Tahoe, CA, USA, Proceedings. pages 259-266, IEEE, 2007. [doi]
Abstract is missing.