Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle

Dong Liu, Chek-Sing Teo, Wenyu Liang, Kok Kiong Tan. Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. IEEE T. Automation Science and Engineering, 16(2):668-677, 2019. [doi]

Abstract

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