Zao Liu, Sheldon X.-D. Tan, Hai Wang, Sahana Swarup, Ashish Gupta 0007. Compact nonlinear thermal modeling of packaged integrated systems. In 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013. pages 157-162, IEEE, 2013. [doi]
@inproceedings{LiuTWS013,
title = {Compact nonlinear thermal modeling of packaged integrated systems},
author = {Zao Liu and Sheldon X.-D. Tan and Hai Wang and Sahana Swarup and Ashish Gupta 0007},
year = {2013},
doi = {10.1109/ASPDAC.2013.6509589},
url = {http://dx.doi.org/10.1109/ASPDAC.2013.6509589},
researchr = {https://researchr.org/publication/LiuTWS013},
cites = {0},
citedby = {0},
pages = {157-162},
booktitle = {18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, January 22-25, 2013},
publisher = {IEEE},
isbn = {978-1-4673-3029-9},
}