Challenges and developments of copper wire bonding technology

Peisheng Liu, Liangyu Tong, Jinlan Wang, Lei Shi, Hao Tang. Challenges and developments of copper wire bonding technology. Microelectronics Reliability, 52(6):1092-1098, 2012. [doi]

Authors

Peisheng Liu

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Liangyu Tong

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Jinlan Wang

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Lei Shi

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Hao Tang

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