Peisheng Liu, Liangyu Tong, Jinlan Wang, Lei Shi, Hao Tang. Challenges and developments of copper wire bonding technology. Microelectronics Reliability, 52(6):1092-1098, 2012. [doi]
@article{LiuTWST12,
title = {Challenges and developments of copper wire bonding technology},
author = {Peisheng Liu and Liangyu Tong and Jinlan Wang and Lei Shi and Hao Tang},
year = {2012},
doi = {10.1016/j.microrel.2011.12.013},
url = {http://dx.doi.org/10.1016/j.microrel.2011.12.013},
researchr = {https://researchr.org/publication/LiuTWST12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {6},
pages = {1092-1098},
}