Yeke Liu, Dawei Xiang, Yifan Fu. Prognosis of chip-loss failure in high-power IGBT module by self-testing. In IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society, Florence, Italy, October 23-26, 2016. pages 6836-6840, IEEE, 2016. [doi]
@inproceedings{LiuXF16-0,
title = {Prognosis of chip-loss failure in high-power IGBT module by self-testing},
author = {Yeke Liu and Dawei Xiang and Yifan Fu},
year = {2016},
doi = {10.1109/IECON.2016.7793051},
url = {https://doi.org/10.1109/IECON.2016.7793051},
researchr = {https://researchr.org/publication/LiuXF16-0},
cites = {0},
citedby = {0},
pages = {6836-6840},
booktitle = {IECON 2016 - 42nd Annual Conference of the IEEE Industrial Electronics Society, Florence, Italy, October 23-26, 2016},
publisher = {IEEE},
isbn = {978-1-5090-3474-1},
}