Location resolved transient thermal analysis to investigate crack growth in solder joints

E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger. Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectronics Reliability, 79:533-546, 2017. [doi]

Authors

E. Liu

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Thomas Zahner

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Sebastian Besold

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Bernhard Wunderle

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Gordon Elger

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