E. Liu, Thomas Zahner, Sebastian Besold, Bernhard Wunderle, Gordon Elger. Location resolved transient thermal analysis to investigate crack growth in solder joints. Microelectronics Reliability, 79:533-546, 2017. [doi]
@article{LiuZBWE17,
title = {Location resolved transient thermal analysis to investigate crack growth in solder joints},
author = {E. Liu and Thomas Zahner and Sebastian Besold and Bernhard Wunderle and Gordon Elger},
year = {2017},
doi = {10.1016/j.microrel.2017.06.014},
url = {https://doi.org/10.1016/j.microrel.2017.06.014},
researchr = {https://researchr.org/publication/LiuZBWE17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {79},
pages = {533-546},
}