Tianshi Liu, Hua Zhang, Sundar Babu Isukapati, Emaran Ashik, Adam J. Morgan, Bongmook Lee, WoongJe Sung, Marvin H. White, Ayman Fayed, Anant K. Agarwal. SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology. In 64th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2021, Lansing, MI, USA, August 9-11, 2021. pages 966-969, IEEE, 2021. [doi]
Abstract is missing.