Xiao Liu, Xi Zhang, Domine Leenaerts, Marion K. Matters-Kammerer. A 100 Gb/s DC-Coupled Optical Modulator Driver for 3D Photonic Electronic Wafer-Scale Packaging. In IEEE International Symposium on Circuits and Systems, ISCAS 2020, Sevilla, Spain, October 10-21, 2020. pages 1-5, IEEE, 2020. [doi]
@inproceedings{LiuZLM20,
title = {A 100 Gb/s DC-Coupled Optical Modulator Driver for 3D Photonic Electronic Wafer-Scale Packaging},
author = {Xiao Liu and Xi Zhang and Domine Leenaerts and Marion K. Matters-Kammerer},
year = {2020},
doi = {10.1109/ISCAS45731.2020.9180884},
url = {https://doi.org/10.1109/ISCAS45731.2020.9180884},
researchr = {https://researchr.org/publication/LiuZLM20},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2020, Sevilla, Spain, October 10-21, 2020},
publisher = {IEEE},
isbn = {978-1-7281-3320-1},
}