Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor - researchr publication authors

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Shaobo Liu, Jingyi Zhang, Qing Wu, Qinru Qiu. Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor. In 11th International Symposium on Quality of Electronic Design (ISQED 2010), 22-24 March 2010, San Jose, CA, USA. pages 390-398, IEEE, 2010. [doi]

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