Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor

Shaobo Liu, Jingyi Zhang, Qing Wu, Qinru Qiu. Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor. In 11th International Symposium on Quality of Electronic Design (ISQED 2010), 22-24 March 2010, San Jose, CA, USA. pages 390-398, IEEE, 2010. [doi]

@inproceedings{LiuZWQ10,
  title = {Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor},
  author = {Shaobo Liu and Jingyi Zhang and Qing Wu and Qinru Qiu},
  year = {2010},
  doi = {10.1109/ISQED.2010.5450547},
  url = {http://dx.doi.org/10.1109/ISQED.2010.5450547},
  tags = {context-aware},
  researchr = {https://researchr.org/publication/LiuZWQ10},
  cites = {0},
  citedby = {0},
  pages = {390-398},
  booktitle = {11th International Symposium on Quality of Electronic Design (ISQED 2010), 22-24 March 2010, San Jose, CA, USA},
  publisher = {IEEE},
  isbn = {978-1-4244-6455-5},
}