Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach

M. Lofrano, K. Croes, Ingrid De Wolf, C. J. Wilson. Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectronics Reliability, 51(9-11):1578-1581, 2011. [doi]

Abstract

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