Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, Kevin Skadron. Interconnect lifetime prediction under dynamic stress for reliability-aware design. In 2004 International Conference on Computer-Aided Design (ICCAD 04), November 7-11, 2004, San Jose, CA, USA. pages 327-334, IEEE Computer Society / ACM, 2004. [doi]
Abstract is missing.