A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

Zhenyu Luo, Deyong Chen, Junbo Wang, Yinan Li, Jian Chen. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging. Sensors, 14(12):24244-24257, 2014. [doi]

Abstract

Abstract is missing.