Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation

Yuchun Ma, Xin Li, Yu Wang 0002, Xianlong Hong. Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation. IEICE Transactions, 92-A(12):2979-2989, 2009. [doi]

Abstract

Abstract is missing.