He Ma, Daquan Yu, Jun Wang. The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer. Microelectronics Reliability, 54(2):425-434, 2014. [doi]
@article{MaYW14-0,
title = {The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer},
author = {He Ma and Daquan Yu and Jun Wang},
year = {2014},
doi = {10.1016/j.microrel.2013.10.003},
url = {http://dx.doi.org/10.1016/j.microrel.2013.10.003},
researchr = {https://researchr.org/publication/MaYW14-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {2},
pages = {425-434},
}