Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Bäuscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer. Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. In 12th International Conference on Developments in eSystems Engineering, DeSE 2019, Kazan, Russia, October 7-10, 2019. pages 902-905, IEEE, 2019. [doi]
Abstract is missing.