Siroos Madani, Magdy Bayoumi. Fault tolerant techniques for TSV-based interconnects in 3-D ICs. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]
@inproceedings{MadaniB17-0, title = {Fault tolerant techniques for TSV-based interconnects in 3-D ICs}, author = {Siroos Madani and Magdy Bayoumi}, year = {2017}, doi = {10.1109/ISCAS.2017.8050944}, url = {https://doi.org/10.1109/ISCAS.2017.8050944}, researchr = {https://researchr.org/publication/MadaniB17-0}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017}, publisher = {IEEE}, isbn = {978-1-4673-6853-7}, }