Development of ultra-thinning technology for logic and memory heterogeneous stack applications

N. Maeda, Y. S. Kim, Y. Hikosaka, T. Eshita, H. Kitada, K. Fujimoto, Y. Mizushima, K. Suzuki, Tadao Nakamura, A. Kawai, K. Arai, T. Ohba. Development of ultra-thinning technology for logic and memory heterogeneous stack applications. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Abstract

Abstract is missing.