Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Kenny Mahan, Byung Kim, Bulong Wu, Bongtae Han, Ilho Kim, Hojeong Moon, Young Nam Hwang. Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. Microelectronics Reliability, 63:134-141, 2016. [doi]

Abstract

Abstract is missing.