The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy

M. H. Mahdavifard, M. F. M. Sabri, Dhafer Abdulameer Shnawah, S. M. Said, Irfan Anjum Badruddin, S. Rozali. The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. Microelectronics Reliability, 55(9-10):1886-1890, 2015. [doi]

Abstract

Abstract is missing.