Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix - researchr publication authors

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Patrick Le Maitre, Melanie Brocard, Alexis Farcy, Jean-Claude Marin. Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix. In Keith A. Bowman, Kamesh V. Gadepally, Pallab Chatterjee, Mark M. Budnik, Lalitha Immaneni, editors, Thirteenth International Symposium on Quality Electronic Design, ISQED 2012, Santa Clara, CA, USA, March 19-21, 2012. pages 404-411, IEEE, 2012. [doi]

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