Alexis Farcy - researchr alias

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Viewing Publication 1 - 23 from 23

2021

2020

2018

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated CircuitsPerceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le-Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy. dt, 33(3):21-36, 2016. [doi]

Heat spreading packaging solutions for hybrid bonded 3D-ICsRafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy. 3dic 2016: 1-6 [doi]

2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influenceSimon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaun. mr, 55(8):1205-1213, 2015. [doi]

Stress management strategy to limit die curvature during silicon interposer integrationBenjamin Vianne, Alexis Farcy, Vincent Fiori, C. Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, O. Thomas. 3dic 2015: [doi]

2014

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposerKhadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet. 3dic 2014: 1-8 [doi]

EUROSERVER: Energy Efficient Node for European Micro-ServersYves Durand, Paul M. Carpenter, Stefano Adami, Angelos Bilas, Denis Dutoit, Alexis Farcy, Georgi Gaydadjiev, John Goodacre, Manolis Katevenis, Manolis Marazakis, Emil Matús, Iakovos Mavroidis, John Thomson. dsd 2014: 206-213 [doi]

Using TSVs for thermal mitigation in 3D circuits: Wish and truthCristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy. 3dic 2014: 1-8 [doi]

2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuitsMelanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet. 3dic 2013: 1-8 [doi]

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integrationS. Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy. 3dic 2013: 1-7 [doi]

Thermal correlation between measurements and FEM simulations in 3D ICsP. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. 3dic 2013: 1-6 [doi]

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developmentsBenjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas. 3dic 2013: 1-7 [doi]

2012

Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrixPatrick Le Maitre, Melanie Brocard, Alexis Farcy, Jean-Claude Marin. isqed 2012: 404-411 [doi]

2011

2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuitsLionel Cadix, Alexis Farcy, CÃ©dric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard FlÃ©chet, Pascal Ancey. 3dic 2009: 1-7 [doi]

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stackingElie Eid, Thierry Lacrevaz, SÃ©bastien de Rivaz, CÃ©dric Bermond, Bernard FlÃ©chet, Francis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey. 3dic 2009: 1-6 [doi]

First integration of Cu TSV using die-to-wafer direct bonding and planarizationPatrick Leduc, Myriam Assous, LÃ©a Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon. 3dic 2009: 1-5 [doi]

Influence of 3D integration on 2D interconnections and 2D self inductors HF propertiesJulie Roullard, StÃ©phane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard FlÃ©chet. 3dic 2009: 1-6 [doi]

2008

Predictive Delay Evaluation on Emerging CMOS Technologies: A Simulation FrameworkManuel Sellier, Jean Michel Portal, Bertrand Borot, Steve Colquhoun, Richard Ferrant, Frédéric Boeuf, Alexis Farcy. isqed 2008: 492-497 [doi]

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