Benjamin Vianne, Alexis Farcy, Vincent Fiori, C. Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, O. Thomas. Stress management strategy to limit die curvature during silicon interposer integration. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.