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Colonna

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Clément Tavernier

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Publications by 'J.-P. Colonna'

Publications

Viewing Publication 1 - 4 from 4

2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integrationS. Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy. 3dic 2013: 1-7 [doi]

Which interconnects for which 3D applications? Status and perspectivesY. Lamy, J.-P. Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron. 3dic 2013: 1-6 [doi]

Thermal correlation between measurements and FEM simulations in 3D ICsP. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. 3dic 2013: 1-6 [doi]

2011

3D integration demonstration of a wireless product with design partitioningG. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, J.-P. Colonna, P. Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, N. Hotellier, F. Leverd, R. Liou, J. Michailos, A. Ostrovsky, S. Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon. 3dic 2012: 1-5 [doi]

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