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Laviron

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Publications by 'C. Laviron'

Publications

Viewing Publication 1 - 5 from 5

2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integrationS. Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy. 3dic 2013: 1-7 [doi]

Which interconnects for which 3D applications? Status and perspectivesY. Lamy, J.-P. Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron. 3dic 2013: 1-6 [doi]

Thermal correlation between measurements and FEM simulations in 3D ICsP. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. 3dic 2013: 1-6 [doi]

2009

Charging control on high energy implanters: A process requirement demonstrated by plasma damage monitoringC. Cantin, C. Laviron, G. Gove. mr, 49(2):209-214, 2009. [doi]

Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and belowClaire Fenouillet-Béranger, P. Perreau, S. Denorme, L. Tosti, François Andrieu, Olivier Weber, S. Barnola, C. Arvet, Y. Campidelli, Sébastien Haendler, R. Beneyton, C. Perrot, C. de Buttet, P. Gros, L. Pham-Nguyen, F. Leverd, P. Gouraud, F. Abbate, F. Baron, A. Torres, C. Laviron, L. Pinzelli, J. Vetier, C. Borowiak, A. Margain, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Olivier Faynot, T. Skotnicki. esscirc 2009: 88-91 [doi]

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