Sébastien Gallois-Garreignot - researchr alias

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Viewing Publication 1 - 8 from 8

2018

Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approachThomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier. mr, 86:1-9, 2018. [doi]

2015

2014

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologiesVincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier. mr, 54(4):764-772, 2014. [doi]

2013

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyondVincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier. mr, 53(2):229-235, 2013. [doi]

Thermal correlation between measurements and FEM simulations in 3D ICsP. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. 3dic 2013: 1-6 [doi]

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developmentsBenjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas. 3dic 2013: 1-7 [doi]

2010

Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developmentsSébastien Gallois-Garreignot, Vincent Fiori, D. Nelias. mr, 50(1):75-85, 2010. [doi]

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