Thermo-mechanical characterization of passive stress sensors in Si interposer

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas. Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectronics Reliability, 55(5):738-746, 2015. [doi]

Abstract

Abstract is missing.