Thomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier. Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectronics Reliability, 86:1-9, 2018. [doi]
Abstract is missing.