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Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond

Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier. Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectronics Reliability, 53(2):229-235, 2013. [doi]

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