Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier. Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectronics Reliability, 53(2):229-235, 2013. [doi]
@article{FioriGJT13,
title = {Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond},
author = {Vincent Fiori and Sébastien Gallois-Garreignot and Hervé Jaouen and Clément Tavernier},
year = {2013},
doi = {10.1016/j.microrel.2012.08.015},
url = {http://dx.doi.org/10.1016/j.microrel.2012.08.015},
researchr = {https://researchr.org/publication/FioriGJT13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {2},
pages = {229-235},
}