S. Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy. Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-7, IEEE, 2013. [doi]
Abstract is missing.