Nicolas Sillon - researchr alias

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Viewing Publication 1 - 6 from 6

2011

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applicationsRebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon. 3dic 2010: 1-4 [doi]

2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuitsLionel Cadix, Alexis Farcy, CÃ©dric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard FlÃ©chet, Pascal Ancey. 3dic 2009: 1-7 [doi]

3D integration technology for set-top box applicationDavid Henry, SÃ©verine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier. 3dic 2009: 1-7 [doi]

First integration of Cu TSV using die-to-wafer direct bonding and planarizationPatrick Leduc, Myriam Assous, LÃ©a Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon. 3dic 2009: 1-5 [doi]

System on Wafer: A New Silicon Concept in SiPGilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude. pieee, 97(1):60-69, 2009. [doi]

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