A successful implementation of dual damascene architecture to copper TSV for 3D high density applications

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon. A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]

Abstract

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