Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey. Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-7, IEEE, 2009. [doi]
Abstract is missing.