Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer

Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet. Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-8, IEEE, 2014. [doi]

Abstract

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