Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet. Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-8, IEEE, 2014. [doi]
@inproceedings{DiengABGLJHFLF14,
title = {Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer},
author = {Khadim Dieng and Philippe Artillan and Cédric Bermond and Olivier Guiller and Thierry Lacrevaz and Sylvain Joblot and Gregory Houzet and Alexis Farcy and Yann Lamy and Bernard Fléchet},
year = {2014},
doi = {10.1109/3DIC.2014.7152152},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152152},
researchr = {https://researchr.org/publication/DiengABGLJHFLF14},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}