Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaun. Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectronics Reliability, 55(8):1205-1213, 2015. [doi]
Abstract is missing.