Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy. Heat spreading packaging solutions for hybrid bonded 3D-ICs. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-6, IEEE, 2016. [doi]
Abstract is missing.